ESA Open Invitation to Tender: 1-11124
Open Date: 22/02/2022 14:50 CEST
Closing Date: 06/04/2022 13:00 CEST

Back-thinning of image sensors is a key-element to enhance their performance. Various processes are used today to back-thin the CMOS images sensors, some ways going through wafer size reductionfirst to cope with 6 inches manufacturing lines, other having developed proprietary steps not always aiming to provide the capability to use the aluminium wire bonding for instance. The activity focuses on the technology development of the elementary brick of the back-thinning in 8 inches line and its suitability for space use. The starting point is to use an existing design for space application available as back thinned version with a 6 inches line. The series of testing shall address the space critical area, like extended thermal range, exposure to vacuum, exposure to humidity and also demonstrate that current post-processes (as developed for 6 inches) are feasible and provide similar reliability, as a minimum.One key aspect of this process is to have it available as a service for any CMOS image sensors foundries. In that view, one part of the activity would be dedicated on defining all the details to be included in the layouts by the potential designers of the front-face CMOS imagesensors. In order to achieve all this, this activity encompasses the following tasks:- Process definition: to define the processes and show how mature they are, to proceed to an Equipment Qualification Status Review (EQSR) vs. already qualified line for space e.g. for 6″ CMOS image sensors,- Test plan definition and preparation, process preparation,- Procurement of 8″wafers,- Manufacturing and characterization,- Space environment tests,- Conclusion and recommendations.

Directorate: Directorate of Tech, Eng. Quality
Estabilishment: ESTEC
ECOS Required: No
Classified: No
Price Range: > 500 KEURO
Authorised Contact Person: Franziska Isabella Erkelens-Sickinger
Initiating Service: TEC-EDC
IP Measure: N/A
Prog. Reference: E/0904-611 – GSTP Element 1 Dev
Tender Type: Open Competition
Open To Tenderers From: BE+GB
Technology Keywords: 17-B-I-Visible Detectors (mostly Si based)
Products Keywords: 2-I-3-a-Imaging radiometers / 2-I-3-b-Imaging spectrometers / 2-I-3-d-Lidars