2, October 2017

ESA Open Invitation to Tender AO8881
Open Date: 21/09/2017
Closing Date: 07/12/2017 13:00:00

Status: ISSUED
Reference Nr.: 17.1TT.39
Prog. Ref.: CC for Advanced Tech
Budget Ref.: E/0505-01C – CC for Advanced Tech
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / RF / Microwave Communication (Platform and Payloads) / Communication – BB(Antennas excluded) / Analog: RF front ends
Techology Domains: RF Systems, Payloads and Technologies / RF Technologies and Equipment / RF Equipment
Establishment: ESTEC
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems Dep
Division: Technologies and Product Division
Contract Officer: Rinaudo, Nicole
Industrial Policy Measure: N/A – Not apply
Last Update Date: 25/09/2017
Update Reason: Modified the Letter of Invitation (English version)

Objective:This activity aims to design, develop and experimentally verify a low power planar ferrite switch including drive electronics.Targeted Improvements:Footprint reduction of 40% in the RF section with respect to standard ferrite switches. Enabling highintegration of redundancy rings.Description:There is pressure from payload primes and their customers to reduce the size and mass of payload hardware to allow a higher integration density. This is especially the case for geostationary multibeam systems, where a large number of components are needed, but also for small platforms, such as those intended for non-geostationary satellite constellations.Redundancy is employed for active hardware e.g. LNA, SSPA, TWT, etc. Today redundancy is commonly implemented by a mechanical redundancy ring employing waveguide and coaxial switches, which are large and bulky and hence significantly contribute to the overall payload mass. In this activity a planar ferrite switch shall be designed, developed, manufactured and experimentally verifiedfor redundancy applications. This includes the development of a redundancy ring concept. The selected implementation of the ferriteswitch shall allow the driver electronics to be placed close to and in the same package as the ferrite switch. A possible approachcould be the use of low temperature co-fired ceramic (LTCC) technology, where the ferrite material is embedded in a suitable substrate. The integration of the control electronics together with the RF part shall be part of the activity.

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