ESA Open Invitation to Tender: 1-10689
Open Date: 28/03/2022 12:56 CEST
Closing Date: 20/06/2022 13:00 CEST

The objective of this activity is to design and test a Ka-band on chip integrated diplexer. Targeted Improvements: Enabling technology aiming at integrated receive and transmit front ends for ground terminals. Description: Most Ka-band user terminal transmit and receive active antennas use separate apertures due to the difficulty to integrate the necessary diplexer at each radiating element in a very compact form factor. The integration of the diplexer directly into the front-end active circuit would allow for the use of a single aperture, therefore less obstructive antennas, lower CAPEX (Capital Expenditure) and OPEX (Operational expenditure) as well as a more reliable solution. Micro-machined filters have already been demonstrated with an improved performance compared to lumped elements implementations. Based on this, the aim of the activity is to design an innovate diplexer implementation which will both preserve the properties of the active elements of the integrated front-end (LNA and HPA) and provide acceptable RF performance. An on chip configurable diplexer breadboard will be developed and tested.Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to EMITS news “Industrial Policy measures for non-primes, SMEs and RD entities in ESA programmes”.

Directorate: Directorate Telecom Integrated Applica
Estabilishment: ESTEC
ECOS Required: No
Classified: No
Price Range: > 500 KEURO
Authorised Contact Person: Adriana Lucas
Initiating Service: TIA-TTG
IP Measure: C1
Prog. Reference: E/0534-01G – CC-AT 4.0.1
Tender Type: Open Competition
Open To Tenderers From: AT+BE+CA+CH+CZ+DE+DK+EL+ES+FI+FR+GB+HU+IE+IT+LU+NL+NO+PL+PT+RO+SE
Technology Keywords: 6-E-III-RF Devices
Products Keywords: 4-B-2-a-Transmitter and Receiver assemblies, Frequency converters,…