ESA Open Invitation to Tender AO9899
Open Date: 27/06/2019
Closing Date: 13/09/2019 13:00:00

Status: ISSUED
Reference Nr.:19.133.10
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 – Technology Developme
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: 200-500 KEURO
Products: Launchers / Materials / Metallic / Satellites & Probes / Materials / Metallic
Technology Domains: Materials and Processes / Novel Materials and Materials Technology Includes materials not yet used in space but presenting potential interest. / Material Assessment / Materials and Processes / Materials Processes / Joining / Materials and Processes / Materials for Electronic Assembly / Surface Mount Technologies / Materials and Processes / Materials for Electronic Assembly / Verification of Electronic Assemblies / EEE Components and Quality / EEE Component Technologies / Hybrids and Micropackaging
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Product Assurance and Safety Department
Division: Materials & Components Technology Divisi
Contract Officer: Reinsoo, Anna
Industrial Policy Measure: C2 – Activities in open competition, significant partecipat…
Last Update Date: 27/06/2019
Update Reason: Tender issue

Objective(s) of the Activity: The proposed activity aims to verify a novel surface finish for PCB assemblies and to assess thereliability of these assemblies and related soldering processes. The selected surface finish shall be assessed in order to providethe needed surface planarity for soldering of AAD packages and for improved performance for high speed signals (e.g. > 6.25 Gbps) and RF functionality. In addition, the suitability of the selected surface finish for Cu wire bonding shall be assessed. Additional benefit of the selected surface shall be the avoidance of lead on the PCB potentially needed for enabling future lead-free solder connectionsin space applications. This activity should lead to a completed and successful PCB qualification and assembly verificationfor the selected technology as per the requirements from [AD3] and [AD4] and the work logic described below. Procurement Policy: C(2) = A relevant participation (in terms of quality and quantity) of non-primes (incl. SMEs) is required. For additional information please goto EMITS news “Industrial Policy measures for non-primes, SMEs and RD entities in ESA programmes”.