ESA Open Invitation To Tender AO8931
Open Date: 18/05/2017
Closing Date: 15/09/2017 13:00:00
Status: ISSUED
Reference Nr.: 17.1TT.14
Prog. Ref.: CC for Advanced Tech
Budget Ref.: E/0505-01C – CC for Advanced Tech
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+CA
Tender Type: C
Price Range: > 500 KEURO
Products: Satellites & Probes / Electronics / EEE Components / Wires and cables
Techology Domains: EEE Components and Quality / EEE Component Technologies / Passive Components
Establishment: ECSAT
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems Dep
Division: Technologies and Product Division
Contract Officer: Dean, Andrea
Industrial Policy Measure: N/A – Not apply
Last Update Date: 18/05/2017
Update Reason: Tender issue
The objectives of the activity are:-To reduce the number of DC and RF connection points in a telecom spacecraft.-To develop a recurring harnessing approach.-To develop new connector combining the characteristics of the different established formats in a single optimised design.Targeted Improvements:Reduction of the number of DC connection points by 50% and RF connection points by 15%.Reduction of the harness mass by 30%.Standardisation level of 80% for the overall electrical harness.Reduction of theassembly integration and testing (AIT) activities by reducing the number of connections.Description:The electrical harness is a major contributor to satellite mass and a major driver for electrical accommodation. The number of connection points is increasing due to more and more complex Payloads. The non- recurring task associated to get a bespoke harness leads to technical show stoppers or extra costs. The objective of the proposed activity is to reduce the number of connectors, to develop a recurring harness approachand to develop a new connector combining favourable characteristics of different connectors in a single optimised design.The current architecture is a mix of analogue lines and digital buses. Several technologies might be candidates to optimize the TM/TC links. Wireless communications, power line communications, Universal serial buses and other data buses technologies are among those candidates.The connectivity between different equipments at electrical architecture level shall be studied by reviewing the observability and commandability together with the reliability requirements. An Electrical Model shall be developed, an architecture breadboard, and a scaled connector engineering model shall be designed, developed and manufactured. Simulations and tests shall be conducted to validate the expected performance improvements and demonstrate the developed concepts.
If you wish to access the documents related to the Invitation to Tender, you have to log in to the ESA Portal.