ESA Open Invitation To Tender AO8632
Open Date: 03/05/2016
Closing Date: 14/06/2016 13:00:00

Status: ISSUED
Reference Nr.: 16.138.01
Prog. Ref.: TRP
Budget Ref.: E/0901-01 – TRP
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: > 500 KEURO
Products: Orbital Transportation & Re-entry Systems / Structures / Structures – BB / Structural joints, dampers, interfaces support, ¿
Technology Domains: Mechanisms / Mechanism Core Technologies / Actuator Technologies
Establishment: ESTEC
Directorate: Directorate of Technical & Quality Manag
Department: System, Software & Technology Department
Division: Clean Space Office
Contract Officer: Fabrizi, Lavinia
Industrial Policy Measure: N/A – Not apply
Last Update Date: 03/05/2016
Update Reason: Tender issue

Increased spacecraft demisability is a key solution for LEO platforms to ensure compliance to the SDM requirements. Simulations show that an early break-up of the main structure of a spacecraft exposes the internal equipment and increases demisability. Joining technologies play a significant role in initiating this break-up of the spacecraft main structure. As a consequence, the following technologies shall be studied to promote the early break-up: passive components / materials (e.g. based on shape memory alloys), active mechanisms (e.g. launch locks, active panel opening), joining techniques and joints (e.g. cleats, adhesives, bolted connection, rivet, welds, thermal expansion joints).In particular, the activity includes the following tasks:- Establish a database of typical joining techniques and joints, active mechanisms and passive components / materials- Derive test conditions from re-entry simulation campaign results- Test current joining techniques and assess the impact of joints on the break-up event of spacecraft (e.g. through plasma wind tunnel testing)- Based on a system level analysis of LEO platforms, establish a set of requirements and establish possible concepts for joining techniques and joints, active mechanisms and passive components / materials- Perform a trade-off between and derive requirements for all identified concepts w.r.t. system level impact to recommend and select technologies- Develop and test breadboards for the selected technologies- Derive requirements and technology roadmaps for the technologies identified.

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