LOW NOISE MINIATURISED VERY HIGH FREQUENCY PULSE TUBE COOLER
8, November 2019

ESA Open Invitation to Tender AO10007
Open Date: 07/11/2019
Closing Date: 16/01/2020 13:00:00

Status: ISSUED
Reference Nr.: 19.127.03
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 – Technology Developme
Special Prov.: AT+BE+CH+CZ+DE+DK+EE+ES+FR+FI+GB+GR+HU+IT+IE+LU+NO+NL+PL+PT+RO+SE
Tender Type: C
Price Range: KEURO
Products: Satellites & Probes / Thermal Control / Cryogenic and Refrigeration / Stirling, Pulse Tube, J. Thomson
Technology Domains: Thermal / Cryogenics and Refrigeration / Cryo-Coolers
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Mechanical Department
Division: Thermal Division
Contract Officer: Magne-Lie, Karine
Industrial Policy Measure: N/A – Not apply
Last Update Date: 07/11/2019
Update Reason: Tender issue

The objective of this activity is to develop, build and test a Breadboard of a miniaturized very high fequency Pulse Tube cooler that can suit the needs of Earth Observation missions. More specifically small sized SWIR/MWIR to TIRmissions that require cooling in the 77K to 120K temperature range. The main key requirements are summarised hereafter:-Mass: < 750g-Cooling Power at 25W input Power and 20degC I/F Temperature: 2W@120K-Cooling Power at 25W input Power and 20degC I/F Temperature: 1W@77K-Driving Frequency: > 90Hz-Exported Microvibrations in piston axis (all harmonics, assuming compensation): <0.1N-Exported Microvibrations in transverse axis (all harmonics): <0.25N-Minimum operational temperature at -73degCThis project being part of the Technology Development Element, innovation is encouraged. Considering the potential markets that a miniaturised cooler could appeal to (e.g. New Space) a certaindegree of design to cost is recommended.Note: Considering the fact that one of the driving innovation of the item to be developedis the form factor/miniaturization which is difficult to be breadboarded, it is expected that at least part of the system (e.g. compressor) will almost be at Engineering Model level.

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