31, March 2019

ESA Open Invitation to Tender AO9775
Open Date: 28/03/2019
Closing Date: 31/05/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.133.01
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 – Technology Developme
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Electronics / EEE Components / Other / Satellites & Probes / Mechanisms / Mechanisms ¿ BB / Sensors: Position sensors, Velocity, Acceleration, Stress, …
Techology Domains: Mechanisms / Mechanism Core Technologies / Motion & Force Sensor Technologies / EEE Components and Quality / EEE Component Technologies / Optoelectronic Active and Passive Components
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Mechanical Engineering Department
Division: Structure and Mechanisms Division
Contract Officer: Reinsoo, Anna
Industrial Policy Measure: N/A – Not apply
Last Update Date: 28/03/2019
Update Reason: Tender issue

The main goal of this activity is to design, manufacture and test a breadboard model (BBM) of a position sensor, targeting low cost, low accuracy (8 to 10 bits) and high reliability.Based on the set of requirements obtained from the market survey and the technology proposed, a concept design will be defined. After, the breadboard will be manufactured and tested in laboratory conditions to proof the feasibility of the concept.The main tasks of the activity are:-Establish a set of requirements based on market survey-Identify the most suitable solution to achieve the requirements established -Design a low cost, low resolution position sensor. -Manufacture a Breadboard model of the position sensor -Perform functional testing of Breadboard Position sensor in laboratory conditions-Analysis of resultsA preliminary set of requirements is specified in Annex B that shall beused as a starting point to obtainthe final set of requirements. The Technology Readiness Level (TRL) to be achieved is TRL 4 i.e. Component and/or breadboard functional verification in laboratory environment.

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