ESA Open Invitation to Tender AO10027
Open Date: 27/09/2019
Closing Date: 13/11/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.127.04
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 – Technology Developme
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Thermal Control / Heat Transport / Low temperature CPL/LHP (Capillary Pumped Loop/Loop Heat Pipe)
Technology Domains: Thermal / Heat Transport Technology / Capillary-Driven Loops
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Mechanical Engineering Department
Division: Thermal Division
Contract Officer: Almeida, Rudolfo
Industrial Policy Measure: N/A – Not apply
Last Update Date: 27/09/2019
Update Reason: Tender issue

Objective(s) of the Activity:The main objective of this technological development is to design, build and test a breadboard model of a Low Temperature LHP with a transport capability in a range 30W-70W operating in the range 100K-150K. The contractor shall perform a critical review of preliminary requirements (in Annex A) assisted by trade-off studies to provide the best promising concept solution. Then, a LHP breadboard shall be designed and analysed. Finally, a LHP breadboard shall be manufactured and shall undergo characterization tests where the performance requirements shall be demonstrated.