ESA Open Invitation to Tender AO9862
Open Date: 16/05/2019
Closing Date: 11/07/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.127.02
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 – Technology Developme
Special Prov.: AT+BE+CH+CZ+DE+DK+EE+ES+FR+FI+GB+GR+HU+IT+IE+LU+NO+NL+PL+PT+RO+SE
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Thermal Control / Heat Transport / Other Capillary Driven Loops
Technology Domains: Thermal / Heat Transport Technology / Capillary-Driven Loops
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Mechanical Engineering Department
Division: Thermal Division
Contract Officer: Magne-Lie, Karine
Industrial Policy Measure: N/A – Not apply
Last Update Date: 17/05/2019
Update Reason: Modified the Statement of Work (English version)

The main objective of this study is to design, manufacture and test an engineering model (so-called breadboard for the rest of thisSoW) of a LHP to demonstrate hardware and techniques capabilities of filling LHP with working fluid on spacecraft, while ensuring the expected performance.This means that performance shall be demonstrated first at LHP level prior to a simulated integration on spacecraft where it shall be then guaranteed by adequate procedures and workmanship verification plan.In particular, an adapted AIV approach (including spacecraft level activities) that copes with dismountability, safety, cleanliness and performance requirements shall be proposed.Then, any additional hardware (standard or quick connect connectors for instance) shall be studied and characterized for the use in a typical environment specified in par.5.All equipment level procedure (manufacturing, workmanship verification orsafety), exercised as is or with modifications at spacecraft level, shall also be characterized anddocumented.Finally, the breadboard will be used to experience overall AIV sequence and its repeatability, to assess performance conservation and to discuss any limitation or discrepancy with preliminary requirements specified in par.5. Note that the breadboard shall not be subjected to a full qualification testing but a reduced set (to be defined by contractor and approved by ESA) to answer the objective of the study.