ESA Open Invitation To Tender AO9003
Open Date: 31/05/2017
Closing Date: 14/07/2017 13:00:00

Status: ISSUED
Reference Nr.: 17.133.07
Prog. Ref.: GSTP Element 1 Dev
Budget Ref.: E/0904-611 – GSTP Element 1 Dev
Special Prov.: BE
Tender Type: C
Price Range: > 500 KEURO
Products: Launchers / Electronics / EEE Components / Other / Launchers / Materials / Composite Materials / Reinforcement Material: Others / Satellites & Probes / Electronics / EEE Components / Other / Satellites & Probes / Materials / Composite Materials / Reinforcement Material: Others / Satellites & Probes / On-board Data Management / On Board Data Management ¿ BB / Other
Techology Domains: Materials and Processes / Materials for Electronic Assembly / Printed Circuit Board Technologies
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Product Assurance and Safety Department
Division: Materials & Components Technology Divisi
Contract Officer: van Hilten, Linda
Industrial Policy Measure: N/A – Not apply
Last Update Date: 31/05/2017
Update Reason: Tender issue

High density interconnect (HDI) components have a higher number of interconnects which are spaced at a small pitch. The routing in the PCB becomes more complex because of signal integrity for high speeds and because of the dense volume for interconnecting the high number of I/Os. This necessitates the use of laser drilled microvias, high aspect ratio core vias and small track width and spacing. The manufacturing processes are a delicate balance of capability and reliability, as changes to accommodate benefits in one area,typically cause disadvantages elsewhere.Several advanced manufacturing processes need to be developed such as plating in high aspect through-holes, crack-free drilling and de- smear, layer registration, laser drilling, copper filling, via plugging, clean lamination and fine line etching. This technology is used in other electronics industry. The highest capability can be found in smart phones. A reasonable balance between capability and reliability can be found in military industry. Space has limited heritage for few projects and can benefit from spinning in.Examples of electronic equipment for space projects that used HDI are GAIA Video Processor Unit, GAIA Maxwell processor board, Alphasat processors, Sentinel 2 FMM, Inmarsat 4 DSP, EDRS DPU.The following tasks will be performed: Qualify HDI PCBs with a design in accordance with ECSS-Q-ST-70-12C. This is driven for example by Virtex 5 component with a pitch of 1 mm for 1752 I/Os. This development targets qualification as soon as possible. Evaluate HDI PCB with designs that exceedECSS-Q-ST-70-12C. This includes 2 layers of microvias and 60 micron track width and spacing. This is driven by component pitch of 0.5-0.8 mm. This development targets evaluation to prepare for qualification in 3 to 5 years. Develop an HDI capability sample that can be used to assess PCB manufacturer’s capabilities and reliability of the technology. Today’s standard qualification vehicleisoutdated and the new capability sample would better challenge the capabilities of the manufacturer in a similar way as the so-called PCQR2 sample that has been developed in US. (300 keuro)Benchmark the IST (Interconnect Stress Test) performance for typicalmanufacturers, materials and HDI designs and compare with newly developed HDI designs.Verify the assembly of HDI components on HDI PCBs.

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