VERY HIGH-THROUGHPUT INTER-CONNECTIVITY SOLUTIONS BASED ON ADVANCED MICROPHOTONICS FOR FUTURE DIGITAL TELECOMMUNICATIONS PAYLOADS
11, October 2019

ESA Open Invitation to Tender AO9954
Open Date: 10/10/2019
Closing Date: 28/11/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.129.20
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 – Technology Developme
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: > 500 KEURO
Products: Satellites & Probes / RF / Microwave Communication (Platform and Payloads) / “Communication – BB (Antennas excluded)” / Digital: Cryptographic, Digital Signal Processors
Technology Domains: Optoelectronics / Photonics / Micro- & Nano-Photonics
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Mechanical Department
Division: Mechatronics and Optics Division
Contract Officer: Reinsoo, Anna
Industrial Policy Measure: N/A – Not apply
Last Update Date: 10/10/2019
Update Reason: Tender issue

Objective of the activity: To assess the suitability and demonstrate the benefits of advanced microphotonic solutions for the implementation of very high-throughput inter-connections and routing for future digital Communication Satellites Payloads.

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