ESA Open Invitation to Tender AO9868
Open Date: 25/06/2019
Closing Date: 30/08/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.1ED.07
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 – Technology Developme
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Electronics / EEE Components / Capacitors / Satellites & Probes / Electronics / EEE Components / Monolithic Microcircuits (including MMICs) / Satellites & Probes / Electronics / EEE Components / Resistors, heaters / Satellites & Probes / Electronics / EEE Components / Other
Technology Domains: EEE Components and Quality / Methods and Processes for Product Assurance of EEE Components, including Radiation Hardness Assurance / Design and Development / Materials and Processes / Materials Processes / Joining
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Electrical Department
Division: Data Syst & Microelectronics Division
Contract Officer: Erkelens-Sickinger, Franziska
Industrial Policy Measure: N/A – Not apply
Last Update Date: 25/06/2019
Update Reason: Tender issue

Currently, the space industry as a whole is facing increasing pressure from customers and environmental lobbyists and supply chains, to reduce or eliminate the use of lead. Pressure is also increasing to reduce the cost of electronic components and equipment usedon launch vehicles. An approach to using lead free components has been written deployed. The document No. VG-SG-1-D-0032-SYS describes steps the steps required to enable the use and delivery of equipment using a variety of components including lead free or puretin terminations. An existing design of an electronic equipment PCB/equipment shall be selected with a suitable selection of component types and finishes. A number of items will be produced using an established process, and subsequently electrical, mechanical andenvironmental testing shall be carried out. Following completion of the manufacturing and testing, analysis will be performed to identify issues, failures and weaknesses exposed by the preceding activities.