ESA Open Invitation to Tender AO9892
Open Date: 20/06/2019
Closing Date: 06/09/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.1TT.44
Prog. Ref.: CC for Advanced Tech
Budget Ref.: E/0505-01C – CC for Advanced Tech
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+CA+HU
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / RF / Microwave Communication (Platform and Payloads) / “Communication – BB (Antennas excluded)” / Other
Technology Domains: RF Systems, Payloads and Technologies / RF Technologies and Equipment / RF Equipment
Establishment: ESTEC
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems Dep
Division: Technologies and Products Division
Contract Officer: Piesche, Claudia Ria
Industrial Policy Measure: N/A – Not apply
Last Update Date: 20/06/2019
Update Reason: Tender issue

Objective:The objective of this activity is to design, manufacture and test low loss waveguides in Ka, Q, V and W-frequency bands for use in future high throughput satellite systems (transmit and receive bands).Targeted Improvements: 20% reduction in insertion losses with respect to the state of the art.Description:Conventional rectangular waveguides have high insertion loss per metre. The most obvious consequences of the high insertion loss of passive components (after the high power amplifier and before the low noise amplifier) in a spacecraft payload are a reduced equivalent isotropic radiated power (EIRP) and a reduced gain to system noise temperature (G/T) figure of merit. Reducing the waveguide loss after the high power amplifier also reduces the thermal dissipation in the waveguide, leading to less stringent payload thermal management requirements. One of the main contributions in terms of losses comes from the waveguide runs connecting the antenna to the repeater (the connections to the high power amplifier and to the low noiseamplifier). This becomes more critical at higher frequencies, where the insertion loss per metre is much higher than is the case atthe lower telecommunication frequencies.In this activity possible means to reduce waveguide insertion losses shall be investigatedand developed, mainly based on alternative waveguide cross sections and materials. Critical parameters, such as surface coatings, tolerances, complexity of manufacturing techniques, RF power handling aspects, such as multipactor and passive intermodulation, mechanical and thermal aspects shall be carefully considered.Following these investigations and trade-offs, engineering models of the most promising solutions at Ka, Q, V and W band shall be developed and tested to confirm the insertion loss performance improvement.