ESA Open Invitation to Tender AO9731
Open Date: 11/06/2019
Closing Date: 10/09/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.1TT.16
Prog. Ref.: CC for Advanced Tech
Budget Ref.: E/0505-01C – CC for Advanced Tech
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+CA+HU
Tender Type: C
Price Range: > 500 KEURO
Products: Satellites & Probes / Thermal Control / Thermal Engineering SW / SW for Thermal design, analysis, simulation, etc.
Technology Domains: Thermal / Thermal Analysis Tools / Thermal Analysis Methods
Establishment: ECSAT
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems Dep
Division: Technologies and Products Division
Contract Officer: Dorval, Nathalie
Industrial Policy Measure: N/A – Not apply
Last Update Date: 11/06/2019
Update Reason: Tender issue

The objective of the activity is to develop a two-phase multi-dimensional heat pipe network breadboard enabling 30% improved thermal performance.Thermal models shall be developed to assist in the design and shall be validated on the breadboard.Targeted Improvements:Improve the thermal performance by more than 30% compared to state of the art.Description: Conventional heat pipe networks use two types of heat pipes. Long heat pipes distribute the heat along the length of the panel. Crossing heat pipes, mounted on top of the long heat pipes, uniformly spread the temperature between the long heat pipes. Unfortunately, this mounting technique createslarge temperature differences between heat pipes due to the various thermal interfaces. Two-dimensional, two-phase structures have been developed where the main and crossing heat pipes are connected together, thereby eliminating the thermal interfaces. However, the fluid distribution and flow within the 2D network is complex and cannot be modelled with existing thermal analysis tools. It has also been shown that conventional design andmanufacturing guidelines for standard heat pipes are not suitable for complex 2D two-phase networks. The tools and dedicated thermal models developed within this activity will be used to optimise and better predict the behaviour and performance of large and complex two-phase networks. They will be embedded within existing thermal analysis software, increasing the analysis capability as well as providing the capability to optimise complex two-phase networks. A two-phase heat pipenetwork breadboard will be manufactured and tested to verify the models.