ESA Open Invitation To Tender AO8882
Open Date: 06/07/2017
Closing Date: 21/09/2017 13:00:00

Status: ISSUED
Reference Nr.: 17.1TT.41
Prog. Ref.: CC for Advanced Tech
Budget Ref.: E/0505-01C – CC for Advanced Tech
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+CA
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Electronics / EEE Components / Filters
Techology Domains: RF Systems, Payloads and Technologies / RF Technologies and Equipment / RF Devices
Establishment: ECSAT
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems Dep
Division: Technologies and Product Division
Contract Officer: Dorval, Nathalie
Industrial Policy Measure: N/A – Not apply
Last Update Date: 06/07/2017
Update Reason: Tender issue

Objective: Objective of the activity is to design and develop surface mountable filters that can be integrated into the RF module of frequency converter equipment.Targeted Improvements: Highly integrated Ku- and Ka-band converters with up to 20% mass and footprint saving with respect to the state of the art,Description: The size of the RF module of a frequency converter is mainly limited by the footprint of the various filters that are needed to remove all of the unwanted signals. Today’s technology can meet the stringent requirements in terms of rejection. However, filters at L to C-band are often too large to be integrated into the RF module. The size of these filters is also an inhibitor to implementing in orbit flexibility, since switchable filter banks become too large and bulky to be practicable.Recently developed circuit techniques promise to overcome these limitations. The design of high in-band performance filters based on low performance resonators is now possible at the expense of higher insertion losses. A dramatic footprint reduction can be achieved by combining this design technique with three dimensional implementation techniques such as Low Temperature Cofired Ceramics (LTCC) or multilayer Printed Circuit Boards (PCB).This activity aims at assessing such compact filters at L, S or C-band, where conventional planar implementation is quite large. Filter engineering models in L-band to C-band shall be designed, developed, manufactured and experimentally verified.

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