ESA Open Invitation to Tender: 1-10871
Open Date: 26/10/2021 10:32 CEST
Closing Date: 06/12/2021 13:00 CEST

Lead-free solder finish is widely available in industry and use in almost all COTS EEE parts. However, high temperature solder material is needed, for internal soldering, to manufacture different types of EEE parts like stacked ceramic capacitor, transformer or relay. This solder material is usually made with lead. Several manufacturers of EEE parts are looking for alternative solder composition to be compliant with lead free requirement. The activity should aim to find at least one solder compound without lead or a process to replace the high soldering temperature today used by most of the manufacturer. This material or process should be compliant with the requirement (i.e. temperature, long operating type application) for mounting EEE part on PCB using the current soldering temperature in space application but also the lead-free process used in commercial application.

Directorate: Directorate of Tech, Eng. Quality
Estabilishment: ESTEC
ECOS Required: No
Classified: No
Price Range: 100-200 KEURO
Authorised Contact Person: Miguel Yagues Palazon
Initiating Service: TEC-SF
IP Measure: N/A
Prog. Reference: E/0600-06 – Discovery
Tender Type: Open Competition
Open To Tenderers From: AT+BE+CA+CH+CZ+DE+DK+EE+EL+ES+FI+FR+GB+HU+IE+IT+LT+LU+LV+NL+NO+PL+PT+RO+SE+SI
Technology Keywords: 26-OTHERS
Products Keywords: 2-P-Other

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