ESA Open Invitation to Tender: 1-10964
Open Date: 06/10/2021 10:46 CEST
Closing Date: 17/11/2021 13:00 CEST

This activity aims to demonstrate the manufacturability, strength, stiffness and thermoelastic stability performance of CMC sandwich structures in optical bench applications. This demonstration is expected both at coupon and at full scale demonstrator level. More specifically the activity shall meet the following objectives: Demonstrate at coupon level the strength and stiffness of the components of the sandwich structure, e.g. skin, core, etc.Demonstrate at coupon level the strength and stiffness of the joining elements and interfaces (e.g. inserts, bonded interfaces, core to skin interfaces)Develop a representative numerical models to simulate the behaviour of the sandwich componentsDesign and manufacture a C/C SiC breadboard with flight representative interfacesPerform a Thermal Vacuum Test including accurate metrology for CTE performance characterisationPerform a mechanical and thermoelastic model correlationThe breadboard model and related mathematical model will be delivered together with the associated design, analysis and test reports.

Directorate: Directorate of Tech, Eng. Quality
Estabilishment: ESTEC
ECOS Required: No
Classified: No
Price Range: 200-500 KEURO
Authorised Contact Person: Gian Lorenzo Casini
Initiating Service: TEC-MSS
IP Measure: N/A
Prog. Reference: E/0901-01 – Technology Developme
Tender Type: Open Competition
Open To Tenderers From: AT+BE+CH+CZ+DE+DK+EE+EL+ES+FI+FR+GB+HU+IE+IT+LU+NL+NO+PL+PT+RO+SE
Technology Keywords: 16-B-IV-Optical Bench and Mounting Technologies / 20-B-I-Advanced Material Technologies for Stable Structures / 20-B-II-Joining and Mounting Technologies / 20-B-III-Thermo-elastic Stability Verification Technologies
Products Keywords: 2-C-3-d-Reinforcement Material: Silicon Carbide, both Fibre and Particulate (SiC) / 2-C-3-l-Matrix Structure: Others / 2-N-6-a-Cases, supporting rings / 2-N-all.1-h-Other