ARM BASED MCU
20, April 2018

ESA Open Invitation to Tender AO9159
Open Date: 19/04/2018
Closing Date: 31/05/2018 13:00:00

Status: ISSUED
Reference Nr.: 17.1ED.02
Prog. Ref.: Technology Developme;Fut.Mis.Prep.
Budget Ref.: E/0901-01 – Technology Developme;E/E104-E5 – Fut.Mis.Prep.
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU+CA
Tender Type: C
Price Range: > 500 KEURO
Products: Satellites & Probes / On-board Data Management / On Board Data Management ¿ BB / Microcontrollers / Satellites & Probes / Electronics / EEE Components / Monolithic Microcircuits (including MMICs) / Orbital Transportation & Re-entry Systems / On Board Data Mangement / On Board Data Management – BB / Processors and controllers (communication processor, data processing, …) / Launchers / Electronics / EEE Components / Monolithic Microcircuits (including MMICs)
Techology Domains: Onboard Data Systems / Onboard Data Management / Onboard Computers / Onboard Data Systems / Microelectronics for Digital and Analogue Applications / Digital and Analogue Devices and Technologies
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Electrical Engineering Department
Division: Data Systems Division
Contract Officer: Erkelens-Sickinger, Franziska
Industrial Policy Measure: N/A – Not apply
Last Update Date: 19/04/2018
Update Reason: Tender issue

Despite the few solutions already available (ATMega128S, DPC) and the ones under development (GR716) , there is an urgent need for a low-cost, generic, space-qualified microcontroller component that can be easily accommodated in a large variety of platforms and payloads with moderate processing requirements, offering the possibility to distributeintelligence and I/O functionalities into an equipment. An ARM-based solution is considered the preferable one as pointed out in the recent Data Systems harmonization discussionsto make the best use of spin-in from the automotive embedded world (availability of reference designs, software tools, very wide user base, commercial parts fully equivalentin term of functionalities and tools, etc). The anticipated market for such a microcontroller will enable a plethora of design solutions.The device to be developed shall be easily accommodated in a large variety of platforms and payloads with moderate processing requirements, offering the possibility to distribute intelligence and I/O functionalitiesinto the equipments.The ASIC prototype package shall have a limited number of pins, preferably less than 100 pins, but nevertheless shall integrate several analogue and digital peripherals in order to be attractive for a wide range of applications. It shall therefore implement a programmable switch I/O matrix to control the pin level functionality and provide access to the peripherals requested by the different applications.

If you wish to access the documents related to the Invitation to Tender, you have to log in to the ESA Portal.