ESA Open Invitation to Tender AO9159
Open Date: 19/04/2018
Closing Date: 31/05/2018 13:00:00
Status: ISSUED
Reference Nr.: 17.1ED.02
Prog. Ref.: Technology Developme;Fut.Mis.Prep.
Budget Ref.: E/0901-01 – Technology Developme;E/E104-E5 – Fut.Mis.Prep.
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU+CA
Tender Type: C
Price Range: > 500 KEURO
Products: Satellites & Probes / On-board Data Management / On Board Data Management ¿ BB / Microcontrollers / Satellites & Probes / Electronics / EEE Components / Monolithic Microcircuits (including MMICs) / Orbital Transportation & Re-entry Systems / On Board Data Mangement / On Board Data Management – BB / Processors and controllers (communication processor, data processing, …) / Launchers / Electronics / EEE Components / Monolithic Microcircuits (including MMICs)
Techology Domains: Onboard Data Systems / Onboard Data Management / Onboard Computers / Onboard Data Systems / Microelectronics for Digital and Analogue Applications / Digital and Analogue Devices and Technologies
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Electrical Engineering Department
Division: Data Systems Division
Contract Officer: Erkelens-Sickinger, Franziska
Industrial Policy Measure: N/A – Not apply
Last Update Date: 19/04/2018
Update Reason: Tender issue
Despite the few solutions already available (ATMega128S, DPC) and the ones under development (GR716) , there is an urgent need for a low-cost, generic, space-qualified microcontroller component that can be easily accommodated in a large variety of platforms and payloads with moderate processing requirements, offering the possibility to distributeintelligence and I/O functionalities into an equipment. An ARM-based solution is considered the preferable one as pointed out in the recent Data Systems harmonization discussionsto make the best use of spin-in from the automotive embedded world (availability of reference designs, software tools, very wide user base, commercial parts fully equivalentin term of functionalities and tools, etc). The anticipated market for such a microcontroller will enable a plethora of design solutions.The device to be developed shall be easily accommodated in a large variety of platforms and payloads with moderate processing requirements, offering the possibility to distribute intelligence and I/O functionalitiesinto the equipments.The ASIC prototype package shall have a limited number of pins, preferably less than 100 pins, but nevertheless shall integrate several analogue and digital peripherals in order to be attractive for a wide range of applications. It shall therefore implement a programmable switch I/O matrix to control the pin level functionality and provide access to the peripherals requested by the different applications.
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