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DEVELOPMENT OF HIGH DENSITY MODULAR ELECTRICAL INTERCONNECTIONS FOR HIGH DATA RATE APPLICATIONS (ARTES AT 5C.461)

on 13 July 2022

ESA Open Invitation to Tender: 1-11173
Open Date: 08/07/2022 12:42 CEST
Closing Date: 21/10/2022 13:00 CEST

The objective of this activity is to design, develop and test a suite of engineering models of modular backplane high density connectors for high data rate space applications, compatible with the cPCI serial space standard. Targeted Improvements:- enabling routeing of more than 120 channels- achieve an interface bit rate of at least 25 Gbit/sDescription: Today there is an urgent need to develop backplane high data rate interconnections compatible with the compact PCI Serial Space (cPCI SS) standard, capable of routeing data between processing modules of on-board computers. Backplane connectors are critical components to enable high speed interconnections. Currently, there are no European solutions able to reach 25 Gbit/s to 50 Gbit/s as needed for state of the art on board processors. This activity will trade-off connection techniques, including the use of press-fit technology. Engineering models of modularbackplane high density connectors compatible with cPCI serial space standards will be designed, manufactured and tested for use in high data rate space applications. This development will include a range of connectors for different mounting configurations. Additionally the focus of the activity will be to achieve:- at least 25 Gbit/s data rate while meeting the cPCI SS standard,- insertion losses less than 1 dB,- near- and far-end signal crosstalk of less than -28 dB,- differential impedance of 100 Ohms,- and a current rating of at least 2A per contact.Testing will include electrical measurements, thermal cycles and mechanical tests with electrical monitoring.

Directorate: Directorate Telecom Integrated Applica
Estabilishment: ESTEC
ECOS Required: No
Classified: No
Price Range: > 500 KEURO
Authorised Contact Person: Florence Odette Jeanne Glandieres
Initiating Service: TIA-TTS
IP Measure: C1
Prog. Reference: E/0534-01G - CC-AT 4.0.1
Tender Type: Open Competition
Open To Tenderers From: AT+BE+CA+CH+CZ+DE+DK+GR+ES+FI+FR+GB+HU+IE+IT+LU+NL+NO+PL+PT+RO+SE
Technology Keywords: 1-A-II-Hardware Technologies for Payload Data Processing
Products Keywords: 2-B-1-a-Capacitors

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