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EUROPEAN ROADMAP FOR DIGITAL OBP BASED ON DEEP SUB-MICRON MICROELECTRONICS (A1 - 1B.088)

ESA Open Invitation To Tender AO7462
Open Date: 04/04/2013
Closing Date: 30/05/2013



Status: ISSUED
Reference Nr.: 12.1TF.18
Prog. Ref.: ARTES 1-V Budget Ref.: E/0501-01A - ARTES 1-V
Special Prov.: B+DK+F+D+I+NL+E+S+CH+GB+IRL+A+N+FIN+POR+GR+LUX+CZ+CDN+PL+RO
Proc. Prop: NO
Tender Type: C
Price Range: 200-500 KEURO
Establishment: ESTEC
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems
Dep Division: Future Projects Division
Contract Officer: Ulrich Sterzl
Last Update Date: 04/04/2013
Update Reason: Tender issue

The aim of the present activity is (1) to synthesise the requirements on DSM based components when used for the next generation of OBP-based payload architectures, (2) to validate the benefits of using the DSM technology for OBP based payloads and (3) to define the associated technological roadmaps.

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