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PELTIER DEVICE FOR TELECOM LNA APPLICATION (ARTES 5.1: 4D.029) (RE-ISSUE)

ESA Open Invitation To Tender AO7437
Open Date: 25/02/2013
Closing Date: 24/05/2013



Status: ISSUED
Reference Nr.: 13.1TT.56
Prog. Ref.: ARTES 5.1
Budget Ref.: E/0505-01A - ARTES 5.1
Special Prov.: B+DK+F+D+I+NL+E+S+CH+GB+IRL+A+N+FIN+POR+GR+LUX+CZ+RO+CDN
Tender Type: C
Price Range: 200-500 KEURO
Keywords: COMMON SPACECRAFT BUS AND PAYLOAD ELEMENTS / THERMAL CONTROL; SPACECRAFT BUS Establishment: ESTEC
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems
Dep Division: Technologies and Product Division
Contract Officer: Nicole Rinaudo
Last Update Date: 28/03/2013
Update Reason: Loaded a new Clarification(English version)

Objective: Development & qualification test of a small Peltier / TEC (thermo-electric cooler) suitable for cooling an LNA.
Description: With the trend towards higher frequencies and multi spot applications, telecom satellite payloads are demanding much more sensitive receive section to be compatible with high data rate, low power uplinks. The noise figure (G/T) of the receive section isa critical parameter, which is minimised by a) Minimising the length of waveguide between the antenna and the electronic Low Noise Amplifier (LNA). b) Minimising the temperature of the LNA. Today this is typically achieved either by baffles or dedicated heatpipe radiators. These can achieve low temperatures (-10 degrees C) but are heavy and complex, and use up valuable radiator surfacethat would otherwise be used for payload. Furthermore it is difficult to achieve both requirements a) and b) simultaneously, if the LNA is close to the feed then it is unlikely to be close to the radiator surface, requiring a heat pipe connection which increase heat leaks and increases the required radiator surface. An LNA is a small unit (less than 100x100x100mm), and the actual powerdissipation of an LNA is very small (less than 1W),ideally suited to a small Peltier device. A low temperature could be readilyachieved on the LNA, whilst the TEC permits to reject heat at a much higher temp (50 deg.C). The fact that only the LNA is cold allows to minimise heat leaks, and the rejected heat could then be transported to the radiator surfaces via a mini or micro loop heatpipe. This would permit to: 1) maximise rf sensitivity (achieve both a very short waveguide length and a cold LNA). 2) increaseantenna design flexibility (permit to install the LNA directly on the antenna receive horn, even when the horn is on an antenna mast). 3) reduce spacecraft mass (eliminate the complex structures used today). 4) increase available spacecraft radiator surfaceforother payload items. Current TECs for space applications are all manufactured outside Europe. This activity is to a) develop a European TEC, and b) assess its performance and operation in conjunction with an LNA. For the full description of this activity, please consult the telecom website: http://telecom.esa.int/telecom - current and future tenders. Procurement Policy: C(1) = Activityrestricted to non- prime contractors (incl. SMEs). For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and R&D entities in ESA programmes".

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