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3D MOLDED INTERCONNECT DEVICE (3D MID) CHARACTERISATION FOR SPACE TELECOM APPLICATIONS (ARTES 5.1 4A.056) RE-ISSUE 1-8281

ESA Open Invitation To Tender AO8505
Open Date: 05/11/2015
Closing Date: 14/01/2016

Status: ISSUED
Reference Nr.: 15.1TT.83
Prog. Ref.: ARTES 5 Sub-El. 5.1
Budget Ref.: E/0505-01B - ARTES 5 Sub-El. 5.1
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+LU+CZ+RO+CA
Tender Type: C
Price Range: > 500 KEURO
Establishment: ESTEC
Directorate: Directorate Telecom & Integrated Applica
Department: Telecom Technologies,Product&Systems Dep
Division: Technologies and Product Division
Contract Officer: Dorval, Nathalie
Last Update Date: 05/11/2015
Update Reason: Tender issue

The objective of the activity is to characterise the suitability of 3D MID for space applications. 3D MID would allow complex shapes, leading to the removal of part of the spacecraft harness and unit housing. The overall equipment plus harness mass and AIT time should be reduced by 10%. The overall occupied volume by an attitude sensor could be reduced by 50%. For the full description of this activity and up-to-date intended issue quarter/intended issue week information, please consult the telecom website: http://artes.esa.int/artes-51/tenders. Procurement Policy: C(2) = A relevant participation (in terms of quality and quantity) of non-primes (incl. SMEs) is required. For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and R&D entities in ESA programmes".

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