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MANUFACTURE & RELIABILITY TESTING OF NON-HERMETIC (PLASTIC) ENCAPSULATED DEVICES - EXPRO+

on 13 May 2019

ESA Open Invitation to Tender AO9852
Open Date: 08/05/2019
Closing Date: 19/06/2019 13:00:00

Status: ISSUED
Reference Nr.: 19.1ED.06
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 - Technology Developme
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Electronics / EEE Components / Other
Technology Domains: EEE Components and Quality / EEE Component Technologies / Hybrids and Micropackaging
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Electrical Department
Division: Data Syst & Microelectronics Division
Contract Officer: Erkelens-Sickinger, Franziska
Industrial Policy Measure: C1 - Activities in open competition limited to the non-Larg...
Last Update Date: 08/05/2019
Update Reason: Tender issue

Plastic packaging is the most common packaging technology in commercial and automotive markets. The technology has evolved considerably, reducing the different failure modes initially associated with plastic packages. The apparition of Enhanced Plastic (plastic packages with added quality assurance requirements and extended testing is increasing the acceptability of these devices. Proposals to use plastic packaging for flight components are becoming frequent for a variety of missions and programs, as the lower price (compared with traditional EEE packaging) of using plastic packages is highlighted as a method of reducing costs. From the Quality Assurance point perspective, one of the main difficulties in accepting those components is the low visibility or reduced process controls that plastic packaging suppliers are willing to accept. This activity will demonstrate the possibility and costs of packaging a "qualified" device (die) in a plastic package and subsequently test the packaged device to compare the performance and suitability for use in flight applications. A typical example device may be LM139, LM239 or device with similar complexity, history, cost availability.ECSS-Q-ST-60-13C, accepts plastic components on a lot basis, after successful performance of the required test campaign. However, some of these tests could be reduced provided the basic processes are demonstrated to be under control at the packaging manufacturer.This activity encompasses the following tasks:- Identification of a European supply chain device to house in a plastic package.- To manufacture plastic packages to create a suitable test piece.- To define and implement manufacturing process controls for plastic packaging- To perform relevant reliability tests according to ECSS-Q-ST-60-13C Class 1 devices and/or ESCC2566001.- Definition of a Space PIDProcurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and RD entities in ESA programmes".

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